Temperature Sensitivity of Electrical Resistivity of Graphene/Copper Hybrid Nano Ribbon Interconnect: A First Principle Study

  • Mohsin K
  • Srivastava A
  • Sharma A
  • et al.
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Abstract

© The Author(s) 2017. Published by ECS. All rights reserved. Recent studies have shown superior thermal transport of graphene on copper as a potential candidate for the next generation interconnects. Using density function theory (DFT) we have studied the current transport of graphene/copper (G/Cu) hybrid-nano wire interconnect system and compared electrical characteristics with other two dimensional counterparts along with graphene. From the first principle calculation, band structure and density of states have been calculated. Using Landauer-Buttiker (LB) formalism, electrical transport is calculated. We explained why G/Cu hybrid interconnect shows more conductivity than graphene only interconnects with the help of phase space argument. As graphene on copper system has more available density of states near the Fermi level it offers more states than graphene for conduction.

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Mohsin, K. M., Srivastava, A., Sharma, A. K., Mayberry, C., & Fahad, M. S. (2017). Temperature Sensitivity of Electrical Resistivity of Graphene/Copper Hybrid Nano Ribbon Interconnect: A First Principle Study. ECS Journal of Solid State Science and Technology, 6(4), P119–P124. https://doi.org/10.1149/2.0071704jss

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