Abstract
Self-limiting oxidation of SiGe alloy on silicon-on-insulator wafers was investigated. For oxidation at 1000°C, oxidation stops completely after a few hours for the Si1-xGex (x=0.068-0.16) layers. For higher initial Ge concentrations of the SiGe layer, the oxidation saturated in a shorter oxidation time, whereas saturation was not observed for the oxidation at 900 and 1100°C. The authors propose a model for self-limiting oxidation, in which the oxidation saturation is governed by an interfacial Ge-rich layer that depends on the oxidation temperature and the initial Ge concentration. © 2006 American Institute of Physics.
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CITATION STYLE
Shimura, T., Shimizu, M., Horiuchi, S., Watanabe, H., Yasutake, K., & Umeno, M. (2006). Self-limiting oxidation of SiGe alloy on silicon-on-insulator wafers. Applied Physics Letters, 89(11). https://doi.org/10.1063/1.2353812
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