A detailed computational fluid dynamics (CFD) analysis of the cooling of a single board computer (SBC) cabin system is performed using the CFD software FLO EFD 9.0. Air-cooling and water-cooling are used for all major heat generating components with the attached heat sinks in it. North bridge chip, SODIMM memory module and south bridge chip are cooled by airflow. A liquid-cooling system with the microchannel heat sink is used to enhance heat transfer from the CPU. The simulation results show that all the heat generating components by this liquid-cooling system can meet their thermal design requirements. 36W CPU with H-shaped fractal-like microchannel heat sink can be maintained below 42° C at the inlet flow rate of 1.0 ml/s and pumping power of 0.06 W. Also it is decreased by 56% relative to forced air-cooling only.
CITATION STYLE
Xu, S., Guo, Z., Hu, G., Chen, W., Lewis, R., & Wong, C. N. (2014). Thermal and flow fields in single board computer cabin systems using CFD analysis. Engineering Applications of Computational Fluid Mechanics, 8(4), 574–585. https://doi.org/10.1080/19942060.2014.11083308
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