Abstract
Based on the MUMPs platform, this study has established an improved surface micromachining process (MUMPs-like process) to improve the reliability of the stress-induced beams. A novel rigid supporting mechanism is devised to prevent the mirror from offset. Furthermore, with this mechanism various pop-up mirrors could be accomplished. According to this MUMPs-like process, devices are fabricated to evaluate the performance of this assembly mechanism.
Cite
CITATION STYLE
Ho, Y. P., Wu, M., Lin, H. Y., & Fang, W. (2002). A robust and reliable stress-induced self-assembly mechanism for optical devices. In 2002 IEEE/LEOS International Conference on Optical MEMs, OMEMS 2002 - Conference Digest (pp. 131–132). Institute of Electrical and Electronics Engineers Inc. https://doi.org/10.1109/OMEMS.2002.1031478
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