Photo-Activation Bonding of Cyclo-Olefin Polymer Plates: Evaluation of the Bonding Strength and Application to Micro-Fluidic Chips

Abstract

For application to synthetic resin parts and to the fabrication of microfluidic devices made of cyclo-olefin polymer (COP), an adhesive-less bonding technology was developed: photo-activation bonding. A Xe excimer lamp irradiating vacuum ultraviolet (VUV) light of 172 nm wavelength was used as a light source for COP surface modification. The surface modification procedure is extremely simple. A COP plate placed in air with atmospheric pressure is irradiated with the VUV light. Based on VUV photochemistry assisted with atmo-spheric oxygen, a modified layer including large amounts of polar functional groups (-OH, -CHO, -COOH, etc.) is formed on the COP plate. The VUV-modified COP plates were bonded at a low temperature through attractive interactions between the modified layers on the COP plates without deforming the plates＇ preformed microstructures. A strength test of bonding was conducted to elucidate the effects of surface modification and bonding conditions such as VUV-irradiation distance (d VUV), VUV-irradiation time (t VUV), bonding pressure (P B), bonding temperature (T B), and bonding time (t B).