Failure analysis of solder joints with a damage-coupled viscoplastic model

Abstract

This paper presents failure analysis of solder joints with a damage-coupled viscoplastic model. A material model is developed to characterize the elasticity, plasticity, creep and damage of solder. A semi-implicit time-integration approach is adopted for the numerical implementation of the solder model. This solder model has been implemented into finite element codes developed at Sandia National Laboratories and into the commercial, finite element code ABAQUS™ with its user-defined material subroutine UMAT. Finite element analyses are performed on solder joints with the new solder constitutive model and mesh dependency of these analyses is investigated. Copyright © 2003 John Wiley & Sons, Ltd.