Device-layer ovenization of fused silica micromechanical resonators for temperature-stable operation

Abstract

In this paper, we report on temperature-stable operation of multiple MEMS silica resonators on an ovenized fused silica device-layer. Temperature servo-control circuits are implemented for compensating the resonator frequency drift using an on-chip RTD-based temperature sensor. A wide linear range analog controller has been implemented to reduce the effective TCF of fused silica resonator by an order of magnitude. Digital calibration method is further proposed and characterized to mitigate the offset errors induced from the non-ideal temperature sensing. Calibration reduces the resonator frequency drift to within 5 ppm across 105 °C of external temperature change. The power consumption of the ovenized device-layer is lower than 16.2 mW.