Toward CMOS compatible wafer-scale fabrication of carbon-based microsupercapacitors for IoT

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Abstract

This work presents a wafer-scale method of microsupercapacitor (MSC) fabrication. Deposition of the electrode precursor, i.e. graphene oxide, is accomplished through spin-coating which allows for potential application in CMOS compatible processes for future integrated on-chip energy storage systems. Our MSCs have an areal capacitance of 0.4 mF/cm2 at 10 μA, which is a very promising result. Further, the MSC has good rate capability as its capacitance decreases by only 0.03 mF/cm2 when the current increases to 50 μA. The MSCs have a maximum energy density of 0.04 μWh/cm2 and a maximum power density as high as 96 μW/cm2. Additionally, the wafer-scale process demonstrates industrial viability.

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CITATION STYLE

APA

Smith, A. D., Li, Q., Anderson, A., Vyas, A., Kuzmenko, V., Haque, M., … Enoksson, P. (2018). Toward CMOS compatible wafer-scale fabrication of carbon-based microsupercapacitors for IoT. In Journal of Physics: Conference Series (Vol. 1052). Institute of Physics Publishing. https://doi.org/10.1088/1742-6596/1052/1/012143

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