Aluminium-Silicon Lightweight Thermal Management Alloys with Controlled Thermal Expansion

Abstract

With the ever-growing emphasis on global decarbonization and rapid increases in the power densities of electronics equipment in recent years, new methods and lightweight materials have been developed to manage heat load as well as interfacial stresses associated with coefficient of thermal expansion (CTE) mismatches between components. The Al–Si system provides an attractive combination of CTE performance and high thermal conductivity whilst being a very lightweight option. Such materials are of interest to industries where thermal management is a key design criterion, such as the aerospace, automotive, consumer electronics, defense, EV, and space sectors. This paper will describe the development and manufacture of a family of high-performance hypereutectic Al–Si alloys (AyontEX™) by a powder metallurgy method. These alloys are of particular interest for structural heat sink applications that require high reliability under thermal cycling (CTE of 17 μm/(m·°C)), as well as reflective optics and instrument assemblies that require good thermal and mechanical stability (CTE of 13 μm/(m·°C)). Critical performance relationships are presented, coupled with the microstructural, physical, and mechanical properties of these Al–Si alloys.