Styrene-terminated polyphenylene oxide and polybutadiene low dielectric reactive blend

Abstract

Styrene-terminated polyphenylene oxide (SPPO) and low polar thermosetting polybutadiene (PB) resin were employed to obtain a curing system with excellent electrical properties and enhanced thermal properties. By terminal styrenisation, SPPO is cured with PB, forming a continuous phase in the blend. The SPPO/PB blends have excellent solvent resistance and thermal stability, while the good dielectric performance is retained. Especially, when the mass ratio of PB is 0.5, the curing system has a high T g of 226.5°C and excellent dielectric properties with Dk = 2.46 and Df = 0.0022 at 10 GHz, which is suitable for high frequency electrical applications.