Finite Element Modeling of Rigid-Flex PCBs for Dynamic Environments

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Abstract

Rigid-flex circuit boards are becoming more prevalent as the limits are pushed on the size, mass, and geometry of electronic systems. A key aspect of designing a rigid-flex printed circuit boards (PCB) system is an assessment of the dynamic properties of the PCB and predicting system performance under dynamic loading. Among current modeling methodologies for rigid-flex PCB, a simplified modeling methodology that adequately captures the system dynamics does not exist. This article presents a novel, computationally efficient approach for modeling rigid-flex PCB systems and the calibration of the material models via modal testing. The resulting simplified model is able to capture system frequencies, mode shapes, and representative force-displacement behavior. The proposed methodology is used to model NASA Jet Propulsion Laboratory's Pop-Up Flat Folding Explorer Robot (PUFFER) and assess the sensitivity of a system model to input parameters.

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Bell, J., Redmond, L., Carpenter, K., & de la Croix, J. P. (2022). Finite Element Modeling of Rigid-Flex PCBs for Dynamic Environments. Journal of Microelectronics and Electronic Packaging, 19(1), 25–38. https://doi.org/10.4071/imaps.1655356

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