Analysis and design of smart food packaging monitoring model based on chipless RFID sensor

Abstract

Logistics plays a crucial role in shaping the efficiency and effectiveness of business operations. The manual monitoring approach often entails labor-intensive procedures, leading to inefficiencies and ineffectiveness within the logistics sector. The incorporation of sensors into product packaging holds the potential to benefit consumers by ensuring freshness and quality. Simultaneously, it enables retail industries to manage their inventory and verify product authenticity more effectively. Chipless RFID sensors, a wireless technology, offer advantages as a data input medium in the series of activities involved in product distribution systems. The amalgamation of sensor technology and RFID introduces novel prospects for overseeing and controlling perishable products. This study introduces an intelligent radio frequency label equipped with a sensor capable of measuring temperature and humidity. The purpose of this research is to analyze and design a chipless RFID-based product quality monitoring system. The research methodology begins with an identification system, an analysis of the interaction between stakeholders, and analysis and design using SAP Power Design. The implementation of chipless RFID involves industry, chipless RFID architecture, and buyers, as well as the primary environment of the system. Business Process Modeling and Notation Diagrams describe the flow of material and data between actors and describe their processing to produce quality data and information.