Effect of composite post placement on bonding to root canal dentin using 1-step self-etch dual-cure adhesive with chemical activation mode

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Abstract

This study evaluated the effect of composite post placement and/or light-irradiation of dual-cure resin composite on adhesion to root canal dentin using the chemical activation mode of a 1-step self-etch dual-cure adhesive. Post spaces were prepared in extracted premolars. Root canal spaces were applied with Unifil Core EM Self-Etching Bond, which was chemically-polymerized, and then filled with Unifil Core EM with or without the placement of composite post. Half the specimens of each group were light-cured for 10 seconds and the other half were chemically-cured in darkness for 30 minutes. After 24 h storage, microtensile bond strengths (μTBS) at the coronal and apical regions were measured. When light-curing, placement of the composite post significantly reduced the μTBS to root canal dentin. On the other hand, when chemical-curing, there was no significant difference in μTBS between with and without placement of the composite post.

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Okuma, M., Nakajima, M., Hosaka, K., Itoh, S., Ikeda, M., Foxton, R. M., & Tagami, J. (2010). Effect of composite post placement on bonding to root canal dentin using 1-step self-etch dual-cure adhesive with chemical activation mode. Dental Materials Journal, 29(6), 642–648. https://doi.org/10.4012/dmj.2010-006

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