Effects of interfacial dielectric layers on the electrical performance of top-gate In-Ga-Zn-oxide thin-film transistors

Abstract

We investigate the effects of interfacial dielectric layers (IDLs) on the electrical properties of top-gate In-Ga-Znoxide (IGZO) thin film transistors (TFTs) fabricated at low temperatures below 200°C, using a target composition of In:Ga:Zn = 2:1:2 (atomic ratio). Using four types of TFT structures combined with such dielectric materials as Si3N 4 and Al2O3, the electrical properties are analyzed. After post-annealing at 200°C for 1 hour in an O2 ambient, the sub-threshold swing is improved in all TFT types, which indicates a reduction of the interfacial trap sites. During negative-bias stress tests on TFTs with a Si3N4 IDL, the degradation sources are closely related to unstable bond states, such as Si-based broken bonds and hydrogenbased bonds. From constant-current stress tests of Id = 3 μA, an IGZO-TFT with heat-treated Si3N4 IDL shows a good stability performance, which is attributed to the compensation effect of the original charge-injection and electron-trapping behavior. Copyright © 2009 ETRI.