Thermal, Microstructural, and Morphological Analysis of Co-Ni-Ce Microalloyed SAC305 Lead-Free Solder Solidified at Low Cooling Rate

Abstract

Microstructural and morphological effects of cobalt (Co), nickel (Ni), and cerium (Ce) microalloying on the SAC305 lead-free solder alloy were investigated, with emphasis on the solidification behavior under slow cooling conditions. Although the individual effects of these elements have been previously reported, their combined influence remains scarcely addressed. Thermal behavior, elemental composition, and surface integrity of the solder joints were analyzed. The addition of Co, Ni, and Ce resulted in a significant shift of the onset temperature during cooling, indicating reduced undercooling. Microalloying led to a transformation of the intermetallic layer (IML) morphology from scalloped to planar, and a 60% reduction in the number of shrinkage voids. The average β-Sn grain size decreased by 37.5%, while the eutectic area increased from 32% to 38%. The substitution of Cu atoms by Co and Ni within the Cu6Sn5 lattice formed thermodynamically stable (Cu,Co,Ni)6Sn5 phases. These findings demonstrate that the synergistic effect of Co, Ni, and Ce microadditives effectively refines the microstructure, suppresses undercooling, and enhances the overall reliability of SAC305 solder joints.