Preparation of copper-based superhydrophobic surfaces by jet-electrodeposition

Abstract

The surface state of metallic materials significantly affect their physical, chemical, and corrosion behavior. In the present study, superhydrophobic coating with copper deposits fabricated using a jet-electrodeposition device on the pure copper substrates for reducing the corrosion rate of the copper substrates was studied. The effect of the micro-nano structured superhydrophobic coating on the improvement of corrosion resistance was investigated. Factors including the microstructures and wetting properties of coating were comprehensively analyzed using a scanning electron microscope, a Fourier transformed infrared and a surface contact angle meter. Results showed that the superhydrophobic coatings demonstrated a micro-nanostructure on the copper substrates. After modifying the copper deposits with stearic acid, a superhydrophobic surface was consequently obtained. The static contact angle (CA) and the sliding angle of the copper-based superhydrophobic surface were 151.6° and 5.7°, respectively. The samples covered with superhydrophobic coating exhibited relatively higher corrosion potential and lower corrosion current than the bared pure copper samples, indicating a notable enhancement of corrosion resistance characterized using polarization tests by an electrochemical workstation.