Co-packaged datacenter optics: Opportunities and challenges

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Abstract

High-capacity, high-density, power-, and cost-efficient optical links are undoubtedly of critical importance for datacenter infrastructure. However, the optics roadmap has come to a fork in the road: Is it right to continue on the tried and proven path of pluggable modules or is it time to adopt a new deployment model that involves co-packaged optics? Herein, we aim to shed light on the trade-offs involved, enabling technologies, paths to adoption, and potential impact on datacenter network architecture.

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Minkenberg, C., Krishnaswamy, R., Zilkie, A., & Nelson, D. (2021, April 1). Co-packaged datacenter optics: Opportunities and challenges. IET Optoelectronics. John Wiley and Sons Inc. https://doi.org/10.1049/ote2.12020

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