Properties of soldering Cu/Fe alloy produced by powder metallurgy

Abstract

In order to develop an advanced soldering material, the Cu/Fe alloys were produced by using powder metallurgy and the soldering properties were examined. Thermal conductivity of Cu/Fe alloy decreased with the increase in the volume fraction of pores, while it increased with the increase in the volume fraction of Cu particles. Wettability of Cu/Fe alloy was better than that of conventional Fe plating. Comparing the consumption amounts under the same wettability, the amount of Cu/Fe alloy consumed was smaller than that of Fe plating consumed. © 2008 The Japan Institute of Metals.