Photonic integration of Er 3+ :Y 2 SiO 5 with thin-film lithium niobate by flip chip bonding

  • Yang L
  • Wang S
  • Shen M
  • et al.
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Abstract

Rare earth ions are known as promising candidates for building quantum light-matter interface. However, tunable photonic cavity access to rare earth ions in their desired host crystal remains challenging. Here, we demonstrate the integration of erbium doped yttrium orthosilicate (Er 3+ :Y 2 SiO 5 ) with thin-film lithium niobate photonic circuit by plasma-activated direct flip chip bonding. Resonant coupling to erbium ions is realized by on-chip electro-optically tuned high Q lithium niobate micro-ring resonators. Fluorescence and absorption of erbium ions at 1536.48 nm are measured in the waveguides, while the collective ion-cavity cooperativity with micro-ring resonators is assessed to be 0.36. This work presents a versatile scheme for future rare earth ion integrated quantum devices.

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Yang, L., Wang, S., Shen, M., Xu, Y., Xie, J., & Tang, H. X. (2021). Photonic integration of Er 3+ :Y 2 SiO 5 with thin-film lithium niobate by flip chip bonding. Optics Express, 29(10), 15497. https://doi.org/10.1364/oe.423659

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