Rapid heating induced ultrahigh stability of nanograined copper

Abstract

Inherent thermal and mechanical instability of nanograined materials bottlenecks their processing and technological applications. In addition to the traditional stabilization strategy, which is based on alloying, grain boundary relaxation was recently found to be effective in stabilizing nanograined pure metals. Grain boundary relaxation can be induced by deforming very fine nanograins below a critical size, typically several tens of nanometers. Here, we found that rapid heating may trigger intensive boundary relaxation of pure Cu nanograins with sizes up to submicrometers, a length scale with notable instability in metals. The rapidly heated Cu nanograins remain stable at temperatures as high as 0.6 Tm (melting point), even higher than the recrystallization temperature of deformed coarse-grained Cu. The thermally induced grain boundary relaxation originating from the generation of high-density nanotwins offers a alternative approach to stabilizing nanostructured materials.