Visualization of Underfill Flow in Ball Grid Array (BGA) using Particle Image Velocimetry (PIV)

Abstract

This paper presents the experimental methodology using particle image velocimetry (PIV) to study the underfill process of ball grid array (BGA) chip package. PIV is a non-intrusive approach to visualize the flow behavior of underfill across the solder ball array. The BGA model of three different configurations - perimeter, middle empty and full array - were studied in current research. Through PIV experimental works, the underfill velocity distribution and vector fields for each BGA models were successfully obtained. It is found that perimeter has the shortest filling time resulting to a higher underfill velocity. Therefore, it is concluded that the flow behavior of underfill in BGA can be justified thoroughly with the aid of PIV.