Reliable vacuum packaging using NanoGetters and glass frit bonding

Abstract

A new approach to vacuum packaging micromachined resonant, tunneling, and display devices will be covered in this paper. A multi-layer, thin-film getter, called a NanoGetter™, which is particle free and does not increase the chip size of the microsystem has been developed and integrated into conventional wafer-to-wafer bonding processes. Experimental data taken with chip-scale packages using glass frit bonding between the Pyrex and silicon wafers, has resulted in silicon resonators in which Q values in excess of 37,000 have been obtained. Reliability data for vacuum-sealed diaphragms and resonators will be presented. Unlike previous reliability studies without getters, no degradation in Q has been noted with NanoGetter™ parts after extended high temperature storage. Applications for this technology include gyroscopes, accelerometers, displays, flow sensors, density meters, IR sensors, micro vacuum tubes, RF-MEMS, pressure sensors and other vacuum sealed devices.