Electromagnetic imaging through thick metallic enclosures

18Citations
Citations of this article
15Readers
Mendeley users who have this article in their library.

This article is free to access.

Abstract

The ability to image through metallic enclosures is an important goal of any scanning technology for security applications. Previous work demonstrated the penetrating power of electromagnetic imaging through thin metallic enclosures, thus validating the technique for security applications such as cargo screening. In this work we study the limits of electromagnetic imaging through metallic enclosures, considering the performance of the imaging for different thicknesses of the enclosure. Our results show, that our system can image a Copper disk, even when enclosed within a 20 mm thick Aluminum box. The potential for imaging through enclosures of other materials, such as Lead, Copper, and Iron, is discussed.

Cite

CITATION STYLE

APA

Darrer, B. J., Watson, J. C., Bartlett, P. A., & Renzoni, F. (2015). Electromagnetic imaging through thick metallic enclosures. AIP Advances, 5(8). https://doi.org/10.1063/1.4928864

Register to see more suggestions

Mendeley helps you to discover research relevant for your work.

Already have an account?

Save time finding and organizing research with Mendeley

Sign up for free