Abstract
The microstructural evolutions in a Sn-3Ag-0.5Cu system of lead free alloys were predicted by the multiphase field simulation coupled with CALPHAD thermodynamic database. In this simulation, the growth of Cu6Sn 5 at 250°C and the precipitations of Cu3Sn and Ag 3Sn at 150°C were calculated. These calculated micrographs were in good agreement with the experimental measurements. It was confirmed that this calculation method can be applied to the simulation of microstructures in the solidification of lead-free solder system including a Cu-substrate. © 2010 ISIJ.
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Nomura, Y., Minamoto, S., & Nomoto, S. (2010). Simulations of solidification in Sn-3Ag-0.5Cu alloys by the multi-phase-field method. In ISIJ International (Vol. 50, pp. 1920–1924). https://doi.org/10.2355/isijinternational.50.1920
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