Deformation measurement of electronic device using speckle interferometry based on dual-camera technique

Abstract

The speckle interferometer based on multi camera technology using two cameras is applied to a dynamic measurement in this paper. A phenomenon that the package of an electronic device is deformed while running is investigated by the novel technique. To perform high precise measurement by this method, the optimum conditions for measurements are also discussed concerning the size of speckle and the frequency of carrier signal. The deformation process of the object can be analyzed high-resolution. Under the optimum conditions, the deformation process of the package during the operation of an operational amplifier is measured. Then, the local maximum deformation can be estimated as 150nm from experimental results. From the results, it can be also confirmed that electronic devices are deformed by the stress of a heat by an operation every second during the operating time.