Direct machining of curved trenches in silicon with femtosecond accelerating beams

Abstract

Control of the longitudinal profile of ablated structures during laser processing is a key technological requirement. We report here on the direct machining of trenches in silicon with circular profiles using femtosecond accelerating beams. We describe the ablation process based on an intensity threshold model, and show how the depth of the trenches can be predicted in the framework of a caustic description of the beam. © The Authors. All rights reserved.