Validation and application of different experimental techniques to measure electronic component operating junction temperature

Abstract

Increasing power densities and changing component design have brought about the need for accurate measurement of die junction temperature. While many junction temperature measurement techniques exist it is difficult to compare their relative performance. To validate the accuracy of various direct and indirect test methods, the operating junction temperature of board-mounted SO-16 and plastic quad flat packs (PQFP)-160 components has been recorded using standard thermal test die. Numerical analysis was also used to predict junction temperature and component temperature gradients. The performance of each technique was evaluated for accuracy, ease of use and relevance to real applications. Once accuracy had been validated, two indirect measurement techniques were applied simultaneously to identify the magnitude of localized hot-spots generated by nonuniform power dissipation on the PQFP die.