Testing for wearability and reliability of TPU lamination method in E-textiles

Abstract

Electronic textiles (e-textiles) and wearable computing have been emerging increasingly during the last decade. Since the market interest and predictions have grown, the research into increasing reliability and durability of wearables and e-textiles is developing rapidly. The washability of different integration methods and resistance to mechanical stress are the main obstacles being tackled. How-ever, the freedom of movement and overall comfort is still often overlooked during the development phase. It is essential to see the e-textile product as a whole and consider several aspects of user experi-ence. This work will focus on developing and improving the thermoplastic polyurethane (TPU) lamination integration method for e-textiles. In the work, a stretchable copper-polyimide based circuit was laminated onto knit fabric using various TPU films and stacks. The study shares measurable charac-teristics to determine which material assembly and design would ensure the highest durability for the electronics part without losing its original textile softness, flexibility and stretchability.