A Predictive Method of Thermal Expansion Coefficient of POSS Reinforced Silicone Materials

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Abstract

Silicone resin can not only withstand high temperature, but also form S1O2 layer with better heat resistance after ablation at high temperature, which rarely reflects electromagnetic wave. In the manufacturing process of POSS/silicone resin, if the content ratio of POSS can be effectively controlled, the comprehensive properties of the materials can be significantly improved, many weaknesses of the composites can be improved, and the real problems such as the stiffness and strength of the wave transparent composite still need to be greatly improved can be solved. A prediction method for thermal expansion coefficient of POSS reinforced silicone materials is developed, which is convenient for engineering application. The relationship between microstructure and thermal expansion property of materials is understood systematically and accurately, so that the prediction of thermal expansion property and material design are possible.

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Wei, H., Wang, D., & Li, S. (2021). A Predictive Method of Thermal Expansion Coefficient of POSS Reinforced Silicone Materials. In Journal of Physics: Conference Series (Vol. 1965). IOP Publishing Ltd. https://doi.org/10.1088/1742-6596/1965/1/012061

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