Magnetron with a sputtering unit for deposition of binary alloy films and solid solutions of two compounds

Abstract

In this work, for the first time we present a magnetron with a sputtering unit used to deposit films of two metal alloys and binary solid solutions of simple compounds (oxides and nitrides). This unit contains two metal targets located on the same axis. The inner (cold) target is effectively cooled by running water, the outer (hot) target is cooled through the fastening elements and by radiation. The inner target is sputtered through slots in the outer target. Current voltage characteristics of a new magnetron working on direct current in inert and reactive environments have been studied. In pure argon with a low current, the V-I characteristics correspond to the mode of abnormal glow discharge, when the current increases, a maximum appears. In the reactive Ar + N2 environment, the V-I characteristics have a maximum and three sections corresponding to the nitride, transition and metal modes of operation of the sputtering unit.