Effect of electromagnetic wave shield for Co and Cu thin films deposited by magnetron sputtering with multipolar magnetic plasma confinement

Abstract

Electromagnetic wave shield characteristics were studied for Co and Cu thin films prepared by magnetron sputtering with multipolar magnetic plasma confinement (MMPC). The characteristics were measured utilizing the Kansai Electronic Industry Development Center (KEC) Method. Results show that the electric field and magnetic field shield effects depend significantly on the thickness of the Co and Cu thin films. The shielding effectiveness of 1μm-thick deposited Co films for electric and magnetic fields was 69 dB and 51 dB, respectively, measured at 800 MHz. For Cu films, the effectiveness was 77 dB and 61 dB, respectively. It was demonstrated that the electromagnetic wave shield effect of Co and Cu thin films, which is dependent upon the film thickness, is the result of attenuation loss and the skin effect.