Abstract
In this paper, a deep learning-based device modeling framework for design-technology co-optimization (DTCO) is proposed. A ResNet surrogate model is utilized as an alternative to traditional compact models, demonstrating high accuracy in both single-task (I–V or C–V) and multi-task (I–V and C–V) device modeling. Moreover, transfer learning is applied to the ResNet model, using the BSIM-CMG compact model for a 12 nm FinFET SPICE model as the pre-trained source. Through this approach, superior modeling accuracy and faster training speed are achieved compared to a ResNet surrogate model initialized with random weights, thereby meeting the rapid and efficient demands of the DTCO process. The effectiveness of the ResNet surrogate model in circuit simulation for 12 nm FinFET devices is demonstrated.
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CITATION STYLE
Huang, Y., Li, B., Wu, Z., & Liu, W. (2024). ResNet Modeling for 12 nm FinFET Devices to Enhance DTCO Efficiency. Electronics (Switzerland), 13(20). https://doi.org/10.3390/electronics13204040
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