Hot deformation behavior and microstructure characterization of an Al-Cu-Li-Mg-Ag alloy

Abstract

The flow behavior of an Al-Cu-Li-Mg-Ag alloy was studied by thermal simulation tests at deformation temperatures between 350◦ C and 470◦ C and strain rates between 0.01–10 s−1. The microstructures of the deformed materials were characterized by electron backscattered diffraction. Constitutive equations were developed after considering compensation for strains. The processing maps were established and the optimum processing window was identified. The experimental data and predicted values of flow stresses were in a good agreement with each other. The influence of deformation temperature and strain rates on the microstructure were discussed. The relationship between the recrystallization mechanism and the Zener–Hollomon parameter was investigated as well.