Post-fabrication resonance trimming of Si 3 N 4 photonic circuits via localized thermal annealing of a sputter-deposited SiO 2 cladding

  • Xie Y
  • Frankis H
  • Bradley J
  • et al.
5Citations
Citations of this article
5Readers
Mendeley users who have this article in their library.
Get full text

Abstract

We report a resonance trimming technique, applicable to waveguides employing an SiO 2 cladding. The SiO 2 is deposited by a room temperature sputtering process. Resonance shifts of micro-ring resonators of 4.4 nm were achieved with furnace annealing, whereas a resonance shift of 1.4 nm was achieved using integrated micro-heaters. For our device layout, with 30 μ m ring separation, the thermal cross-talk is negligible, and isolated trimming of each micro-ring is achieved. Three, single-channel ring filters on the same substrate were aligned to the same wavelength within a 20 pm precision. The stability of trimmed micro-rings was assessed following extended storage in atmospheric ambient. For a ring shifted by 4.4 nm using furnace annealing, relaxation of 540 pm is observed, while for a ring shifted by 1.4 nm using integrated heaters, the relaxation is 270 pm.

Cite

CITATION STYLE

APA

Xie, Y., Frankis, H. C., Bradley, J. D. B., & Knights, A. P. (2021). Post-fabrication resonance trimming of Si 3 N 4 photonic circuits via localized thermal annealing of a sputter-deposited SiO 2 cladding. Optical Materials Express, 11(8), 2401. https://doi.org/10.1364/ome.426775

Register to see more suggestions

Mendeley helps you to discover research relevant for your work.

Already have an account?

Save time finding and organizing research with Mendeley

Sign up for free