Abstract
The phase and morphology stability of NiSi and Ni(Pt)Si formed on the poly-Si lines and wide pads have been studied. Differences in the NiSi 2 nucleation temperature and the extent of layer inversion have been analyzed. The nucleation of NiSi 2 was hindered on the narrow poly-Si lines as compared to that on the large area poly-Si pads at 750°C. Stress is believed to play an important role in the delayed nucleation of NiSi 2 . In addition, layer inversion was found to be less severe on the narrow poly-Si lines as compared to that on the poly-Si pads after being subjected to the same annealing condition. This is likely due to the limiting grain growth of the poly-Si in the narrow lines. Enhanced stability of Ni(Pt)Si was achieved up to 800°C on both poly-Si wide pads and narrow lines.
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CITATION STYLE
Lee, P. S., Pey, K. L., Mangelinck, D., Ding, J., Chi, D. Z., Dai, J. Y., & Chan, L. (2002). Phase and Layer Stability of Ni- and Ni(Pt)-Silicides on Narrow Poly-Si Lines. Journal of The Electrochemical Society, 149(6), G331. https://doi.org/10.1149/1.1473192
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