Review of Hazardous Agent Level in Wafer Fabrication Operation Focusing on Exposure to Chemicals and Radiation

Abstract

Objectives: The aim of this study is to review the results of exposure to chemicals and to extremely low frequency(ELF) magnetic fields generated in wafer fabrication operations in the semiconductor industry. Methods: Exposure assessment studies of silicon wafer fab operations in the semiconductor industry were collected through an extensive literature review of articles reported until the end of 2015. The key words used in the literature search were "semiconductor industry", "wafer fab", "silicon wafer", and "clean room," both singly and in combination. Literature reporting on airborne chemicals and extremely low frequency(ELF) magnetic fields were collected and reviewed. Results and Conclusions: Major airborne hazardous agents assessed were several organic solvents and ethylene glycol ethers from Photolithography, arsenic from ion implantation and extremely low frequency magnetic fields from the overall fabrication processes. Most exposures to chemicals reported were found to be far below permissible exposure limits(PEL) (10% < PEL). Most of these results were from operators who handled processes in a well-controlled environment. In conclusion, we found a lack of results on exposure to hazardous agents, including chemicals and radiation, which are insufficient for use in the estimation of past exposure. The results we reviewed should be applied with great caution to associate chronic health effects. I. 서 론 반도체 산업(Semiconductor industry) 핵심 공정은 모래(SiO2)로부터 실리콘(silicon, Si)을 추출(환원)하 여(웨이퍼 제조 공정) 생산된 전기 특성이 없는(부도 체) 실리콘 웨이퍼(wafer)에 전기적 특성을 부여하는 것이다. 실리콘 웨이퍼 위에 전기 회로를 만들고(가공 (fabrication),이하 웨이퍼 가공 공정), 회로화된 수많 은 작은 칩들(chips)을 개별로 분리하여 제품으로 만 든다(이하 칩 패키지 공정). 화학물질과 에너지가 가 장 많이 사용되는 웨이퍼 가공 공정은 제조된 웨이퍼 의 산화(oxidation) 감광액 도포(photolithography resist application) 노광(photolithography exposure) 현상(developing) 식각(etching) 스트리핑 (stripping) 이온 주입 실리콘 증착(epitaxy) 금 속배선을 위한 증착(metallization)이 반복되는 과정이 다. 모든 공정에서 건강에 장해를 줄 수 있는 화학물 질이 발생되고 에너지가 사용된다.