Modeling High-Frequency and DC Path of Embedded Discrete Capacitor Connected by Double-Side Terminals with Multi-layered Organic Substrate and RDL-based Fan-out Package

Abstract

Through this work, two-sided model (TSM) for embedded discrete capacitor is presented by authors. When two sides of the discrete ceramic capacitor embedded in multi-layered organic substrate or redistribution layer (RDL) based fan-out package are connected to metal layers in substrate or RDL, which are placed over and under the embedded capacitor, the proposed TSM of capacitor is required to properly represent the impedance characteristic of power delivery network (PDN). It is demonstrated that impedance representing PDN with one-sided model is not proper and accurate, based on which it will be addressed that power delivery network (PDN) should be properly represented and optimized by using TSM of embedded capacitor.