Highly efficient ionic wind-based cooling microfabricated device for microchip cooling applications

Abstract

This work explores an innovative and advanced thermal management solution using a microfabricated air-cooling technology that employs an electrohydrodynamic corona discharge (i.e. ionic wind pump) to stimulate forced convection for efficient heat removal from electronic components and devices. The device provides a high COP (coefficient of performance) of 20.5. In fact, the grid structures used in its design enhance the overall heat transfer coefficient and facilitate a batch and IC compatible process. ANSYS™ was used to computationally simulate the jet impingement phenomenon and resulting cooling effects of the device. COMSOL Multiphysics™ was additionally employed to computationally explore the effects of collector-emitter configuration. For a larger-scale application, performance can be appreciably enhanced by using an array of these microscale devices.