Ultrathin silicon oxynitride layer on GaN for dangling-bond-free GaN/insulator interface

12Citations
Citations of this article
22Readers
Mendeley users who have this article in their library.

This article is free to access.

Abstract

Despite the scientific and technological importance of removing interface dangling bonds, even an ideal model of a dangling-bond-free interface between GaN and an insulator has not been known. The formation of an atomically thin ordered buffer layer between crystalline GaN and amorphous SiO2 would be a key to synthesize a dangling-bond-free GaN/SiO2 interface. Here, we predict that a silicon oxynitride (Si4O5N3) layer can epitaxially grow on a GaN(0001) surface without creating dangling bonds at the interface. Our ab initio calculations show that the GaN/Si4O5N3 structure is more stable than silicon-oxide-terminated GaN(0001) surfaces. The electronic properties of the GaN/Si4O5N3 structure can be tuned by modifying the chemical components near the interface. We also propose a possible approach to experimentally synthesize the GaN/Si4O5N3 structure.

Cite

CITATION STYLE

APA

Nishio, K., Yayama, T., Miyazaki, T., Taoka, N., & Shimizu, M. (2018). Ultrathin silicon oxynitride layer on GaN for dangling-bond-free GaN/insulator interface. Scientific Reports, 8(1). https://doi.org/10.1038/s41598-018-19283-4

Register to see more suggestions

Mendeley helps you to discover research relevant for your work.

Already have an account?

Save time finding and organizing research with Mendeley

Sign up for free