Numerical simulation of the 3ω method for measuring the thermal conductivity

Abstract

A four-pad 3ω method was developed for determining the thermal conductivity of bulk and thin film materials. The heat conduction in the sample geometry was investigated by numerical simulation employing the finite volume technique. As a result, the conditions (i.e., sample geometry, frequency range) can be predicted when conventional analytical formulas are suited to determine the thermal conductivity of bulk and thin film material from the data measured. Experiments were performed that confirm the validity and accuracy of the numerical calculations. © 2002 American Institute of Physics. © 2002 American Institute of Physics.