The Multidimensional Integrated Intelligent Imaging project (MI-3)

Abstract

MI-3 is a consortium of 11 universities and research laboratories whose mission is to develop complementary metal-oxide semiconductor (CMOS) active pixel sensors (APS) and to apply these sensors to a range of imaging challenges. A range of sensors has been developed: On-Pixel Intelligent CMOS (OPIC)-designed for in-pixel intelligence; FPN-designed to develop novel techniques for reducing fixed pattern noise; HDR-designed to develop novel techniques for increasing dynamic range; Vanilla/PEAPS-with digital and analogue modes and regions of interest, which has also been back-thinned; Large Area Sensor (LAS)-a novel, stitched LAS; and eLeNA-which develops a range of low noise pixels. Applications being developed include autoradiography, a gamma camera system, radiotherapy verification, tissue diffraction imaging, X-ray phase-contrast imaging, DNA sequencing and electron microscopy. © 2009 Elsevier B.V. All rights reserved.