Characterization of alloys and liquidus projections of ternary Bi-Sb-Sn system

Abstract

Given that Sn-based lead-free solders are considered as possible substitution for standard lead-tin solders, properties of the alloys from ternary Bi-Sb-Sn system were characterized by microstructural SEM-EDS analysis, Brinell hardness tests, and electrical conductivity measurements. Isothermal cross section at 298 K and liquidus surface projection were calculated by application of CALPHAD method and software package PANDAT 8.1. The experimentally determined phase compositions in analyzed microstructures were found to be in a good agreement with phases on calculated cross sections. Copyright © 2012 De Gruyter.