Abstract
We reported experimental fabrication and characterization of Si 0.15 Ge 0.85 n-MOSFETs comprising a gate-stacking heterostructure of Ge-nanospherical gate/SiO 2 /Si 0.15 Ge 0.85 -nanosheet on SOI (100) substrate in a self-organization approach. This unique gate-stacking heterostructure is simultaneously produced in a single oxidation step as a consequence of an exquisitely controlled dynamic balance between the concentrations of oxygen, Si, and Ge interstitials at 900 °C. Process-controlled tunability of nanospherical gate of 60-100 nm in diameter, gate oxide thickness of 3 nm, and Si 0.15 Ge 0.85 nanosheet with compressive strain of -2.5% was achieved. Superior gate modulation is evidenced by subthreshold slope of 150 mV/dec and I ON I OFF >5 × 10 8 (I OFF < 10 -6 μA μm and I ON >500 μA μm ) measured at V G = +1V , V D = +1 V, and T = 80 K for our device with channel length of 75 nm.
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Liao, P. H., Peng, K. P., Lin, H. C., George, T., & Li, P. W. (2019). Self-Organized Ge Nanospherical Gate/SiO 2 /Si 0.15 Ge 0.85 -Nanosheet n-FETs Featuring High ON-OFF Drain Current Ratio. IEEE Journal of the Electron Devices Society, 7, 57–61. https://doi.org/10.1109/JEDS.2018.2876519
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