Copper electrode material using copper formate-bicarbonate complex for printed electronics

Abstract

Copper ink has been prepared by mixing copper(II) formate and 2-ethyl-1-hexylammonium bicarbonate (EHABC) to overcome some weak points such as aggregation and degradation of copper nano-type ink. Ink was coated on glass substrate and calcined at 110°C to 150°C to generate electrically conductive copper film under two different atmospheres such as nitrogen gas and gaseous mixture of formic acid and methanol. The lowest resistivity of 1.88 μΣcm of copper film was obtained at 150°C in gaseous formic acid condition. The long-term resistivity shows to increase from 1.88 μΣcm to 2.61 μΣcm after one month.