Heat diffusion imaging: In-plane thermal conductivity measurement of thin films in a broad temperature range

Abstract

This work combines the principles of the heat spreader method and the imaging capability of the thermoreflectance measurements to measure the in-plane thermal conductivity of thin films without the requirement of film suspension or multiple thermometer deposition. We refer to this hybrid technique as heat diffusion imaging. The thermoreflectance imaging system provides a temperature distribution map across the film surface. The in-plane thermal conductivity can be extracted from the temperature decay profile. By coupling the system with a cryostat, we were able to conduct measurements from 40 K to 400 K. Silicon thin film samples with and without periodic holes were measured and compared with in-plane time-domain thermoreflectance measurements and literature data as validation for heat diffusion imaging.