Effect of silicon on the microstructure and performance of the new binary deep eutectic Ti-Cu-Zr-Ni-based filler metal

Abstract

This study designed (Ti0.55Cu0.20Zr0.15Ni0.10)1..xSix amorphous alloys based on binary deep eutectics and examined the effect of silicon (Si) on the amorphous forming ability of the filler alloys. The results show that a certain amount of Si added to the filler metals could improve the amorphous forming ability of the alloys. Under the same experimental conditions, the Ti0.55Cu0.20Zr0.15Ni0.10 filler metal with 0.5 wt % Si had the strongest amorphous forming ability compared to the other filler alloys containing different amounts of Si; its reduced glass transition temperature (Trg) was 0.5554, and its supercooled liquid phase region width (ΔTx) reached 60° C. The (Ti0.55Cu0.20Zr0.15Ni0.10)99.5%Si0.5% filler metal designed in these experiments presented good amorphous forming ability and wettability. The brazed joint of SiC and TC4 obtained with this amorphous filler metal showed a shear strength of 102 MPa, indicating an increase of 122% compared to the brazed joint obtained with the filler metal without Si.