Abstract
A novel method, by using micro-Raman spectroscopy, is developed to measure the thickness of microelectromechanical system structures with high spatial resolution. When a microscale structure is heated by a laser, the temperature rise of the structure depends on the structure thickness and material properties. Therefore, the structure thickness can be measured using Raman shift, which is a function of temperature. Micro-Raman spectrometer is capable of measuring the thickness distribution of microscale structures with micron spatial resolution. This technique is evaluated by characterizing the thickness distribution of a single-crystal silicon (c-Si) membrane. The measured thickness distributions are verified by scanning electron microscope measurement. © 2006 American Institute of Physics.
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CITATION STYLE
Wu, X., Ren, T., Liu, L., & Yu, J. (2006). Spatially resolved thickness analysis of microscale structures using micro-Raman spectroscopy. Applied Physics Letters, 89(21). https://doi.org/10.1063/1.2396908
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