Fiberboard manufactured without resin using the Fenton reaction

Abstract

Resin-free fiberboards were manufactured using industrial fiber from Pinus radiata activated by an oxidative treatment using the Fenton reaction (H202/ Fe(II)). A multivariate analysis was used to study the effect of fiber moisture content (MC), press temperature (T), and the H202/Fe(II) ratio on the board internal bond strength (IB). Using response surface methodology, a set of máximum IB conditions was obtained. Validation of these conditions which included 25% MC, 170°C press temperature and a H202/Fe(II) relation of 25 produced an optimal board with an IB strength of 0.888 MPa. Without the addition of sizing agents or other additives, the dimensional stability properties were 16% of thickness swell and 40% of the water absorption of control boards. © 2009 Sociedad Chilena de Química.