Thermal Design and Heat Transfer Analysis of Heat Sinks and Enclosures: A Review

Abstract

Heat sinks are used as heat exchangers to dissipate heat from electronic equipment due to their high functionality and viability. However, heat dispersion is the main obstacle to improving the heat sinks thermal efficiency. This paper has two main parts. The first part of this study focuses on the thermal design of the heat sink, encompassing several factors such as heat dissipation devices using natural convection, heat sinks with various geometries, locations of intake and outlet, materials of the core, flat fins (especially FPFHS and PFHS fins), and porosity fins. Heat sinks that are single-layered or multi-layered and heat sinks that use different cooling liquids. The second part examines interior heat transmission by investigating various indoor geometries, including cylindrical, circular, rectangular, and hexagonal shapes, and assessing their effect on the transport of heat. Additionally, interior structures influence various fin arrangements for any type of heat convection, including actual trials conducted on enclosures using diverse fin designs, are considered. The current study aims to collect research literature that studies the heat sink and various enclosures. The research has been divided into groups to simplify the research process for activities that use cavitation-based technology to improve heat transfer for heat sinks, especially heat exchangers used to cool electrical equipment. These advantages can be attributed to their outstanding features, which include ease of production, cost-effectiveness, and effective heat dissipation.