Mechanical integrity assessment of two-side etched type printed circuit heat exchanger with additional elliptical channel

Abstract

Printed circuit heat exchangers (PCHEs) are often subject to high pressure and temperature difference between the hot and cold channels which may cause a mechanical integrity problem. A conventional plate heat exchanger where the channel geometries are semi-circular and etched at one side of the stacked plate is a common design in the market. However, the sharp edge tip channel may cause high stress intensity. Double-faced type PCHE appears with the promising ability to reduce the stress intensity and stress concentration factor. Finite element analysis simulation has been conducted to observe the mechanical integrity of double-etched printed circuit heat exchanger design. The application of an additional ellipse upper channel helps the stress intensity decrease in the proposed PCHE channel. Five different cases were simulated in this study. The simulation shows that the stress intensity was reduced up to 24% with the increase in additional elliptical channel radius. Besides that, the horizontal offset channels configuration was also investigated in this study. Simulation results show that the maximum stress intensity of 2.5 mm offset configuration is 9% lower compared to the maximum stress intensity of 0 mm offset. This work proposed an additional elliptical upper channel with a 2.5 mm offset configuration as an optimum design.